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Hing Technology Co. Ltd
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big data cloud computing and 5G communication PCB high-speed boards and high multi-layer boards with the high reliability, high stability and high

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big data cloud computing and 5G communication PCB high-speed boards and high multi-layer boards with the high reliability, high stability and high

Certification : CE ROHS

working Temp. : -40~+85

Payment Terms : T/T,L/C,D/P,D/A,Western Union

Place of Origin : CN

Delivery Time : 30-40 days

Brand Name : Hing

Product Name : HDI Printed Circuit Board Pcb

MOQ : 50

Supply Ability : 500000pcs/month

Packaging Details : 1set/box

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big data cloud computing and 5G communication PCB high-speed boards and high multi-layer boards with the high reliability, high stability and high fault tolerance ability PCB
Company Introduction

Shenzhen Hing Technology Co., Ltd was established in 2016. The company is a national high-tech enterprise specializing in the research and development, production and sales of printed circuit boards. Since its establishment, the company has long adhered to the development strategy of quality first, technology as the core, and customer demand as the orientation, focusing on the high-end segmented circuit board market covering an area of approximately 10000 square meters.

The company's products are widely used in communication, new energy, industrial control, consumer electronics, automotive electronics and medical electronics and other application fields, and the products serve well-known customers at home and abroad.


  • With up to 14 layer any layer capability
  • Min line width and spacing in volume production is around 40μm
  • Fine pitch BGA with 0.35mm
  • Capability of plated copper or filled with conductive paste for stacked microvias
  • Heavy Copper, embedded coin and provide a thermal management solution
  • Support planar surface for ball grid array ("BGA") (Via-in-Pad) Enhance impedance performance
  • Enhance impedance performance
  • Microvias solutions for Radio Frequency HDI boards
  • High speed material for hybrid HDI
  • Wide range laminate support (Low Tg , high Tg material and halogen free material )
  • Low-DK laminate for smart devices
  • Signal integrity enhancement
  • Edge plating capability

  • big data cloud computing and 5G communication PCB high-speed boards and high multi-layer boards with the high reliability, high stability and high
big data cloud computing and 5G communication PCB high-speed boards and high multi-layer boards with the high reliability, high stability and high

big data cloud computing and 5G communication PCB high-speed boards and high multi-layer boards with the high reliability, high stability and high
big data cloud computing and 5G communication PCB high-speed boards and high multi-layer boards with the high reliability, high stability and high

Frequently Asked Questions
Do you offer samples?
Yes, we offer samples for testing.
What's your MOQ?
Our MOQ is 1 pcs, the first order is negotiable.
How do you test your products?
We use AOI or Flying Probe Test or Bed of Nails Test or Impedance Test.
Do you make OEM products?
Yes, we can do.
Do you have RoHS certification?
We can do RoHS certification according to customers' requirements. The customers need to charge the handing fee. Or we can provide customers the SGS report of the material for free.
Our Services
  • Your inquiry will be replied within 12 hours
  • Well-trained & experienced sales can reply your inquiries in English
  • During working time, E-mail will be replied to you within 2 hours
  • OEM & ODM projects are highly welcomed, we have strong R&D team
  • The order will be produced exactly according to order details and proofed samples, our QC will submit inspection report before shipment
  • Your business relationship with us will be confidential to any third party
  • Good after-sale service

Product Tags:

5G Communication HDI PCB

      

High Layer Count HDI PCB

      

Data Center HDI PCB

      
China big data cloud computing and 5G communication PCB high-speed boards and high multi-layer boards with the high reliability, high stability and high factory

big data cloud computing and 5G communication PCB high-speed boards and high multi-layer boards with the high reliability, high stability and high Images

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